Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074563 | Structure and formation method of interconnection structure of semiconductor device | Hua-Li Hung, Hsu-Yu Huang, Tsung Fan Yin, Ying Ting Hsia, Yi-Wei Chiu +1 more | 2018-09-11 |