Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163751 | Heat transfer structures and methods for IC packages | Ying-Chih Hsu, Alan Roth, Chuei-Tang Wang, Chih-Yuan Chang, Eric Soenen | 2018-12-25 |
CC
Chih-Lin Chen
Overall (2018): #463,436 of 503,207Top 95%
1
Patents 2018