Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037964 | Die-packaging component with retaining structure for package body thereof | Reyn Qin, Meifang Song, Xiaoli Wang | 2018-07-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037964 | Die-packaging component with retaining structure for package body thereof | Reyn Qin, Meifang Song, Xiaoli Wang | 2018-07-31 |