Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10091887 | Multi-material structure with embedded electronics | Mikko Heikkinen | 2018-10-02 |
| 10064282 | Thermoformed plastic cover for electronics and related method of manufacture | Mikko Heikkinen, Jarkko Torvinen | 2018-08-28 |
| 10057989 | Multilayer structure and related method of manufacture for electronics | Mikko Heikkinen, Antti Keränen, Ronald H. Haag | 2018-08-21 |
| 9869810 | Method for manufacturing electronic products, related arrangement and product | Antti Keränen, Tuomas Heikkilä, Paavo Niskala, Kari Severinkangas, Sami TORVINEN | 2018-01-16 |