Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10058019 | Bonding apparatus | Akira Yamada, Toshihiko Tsujikawa | 2018-08-21 |
| 9872395 | Component crimping apparatus | Akira Yamada, Shinjiro Tsuji, Satoshi Adachi, Toshihiko Tsujikawa | 2018-01-16 |