Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9917066 | Semiconductor device having stacked chips, a re-distribution layer, and penetration electrodes | Nobuo Aoi, Yoshihiro Mori, Takeshi Kawabata, Takashi Yui, Toshio Fujii | 2018-03-13 |