Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953946 | Die-bonding layer formation film, processed product having die-bonding layer formation film attached thereto, and semiconductor device | Hideaki Suzuki, Naoya Saiki, Yuta Sagawa | 2018-04-24 |