Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9878903 | Method of manufacturing a temperature-compensated micro-electromechanical device | Angelo Merassi, Sarah Zerbini | 2018-01-30 |
| RE46671 | Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device | Chantal Combi, Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani +1 more | 2018-01-16 |