| 10134795 |
Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing method |
Yoshiya Hagimoto, Kenichi Aoyagi, Yoshihisa Kagawa |
2018-11-20 |
| 10038021 |
Packaged image sensor having improved dicing properties |
Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya +4 more |
2018-07-31 |
| 10038024 |
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
Yoshihisa Kagawa, Kenichi Aoyagi, Yoshiya Hagimoto |
2018-07-31 |
| 10026769 |
Semiconductor device and solid-state imaging device |
Yoshihisa Kagawa, Masanaga Fukasawa, Tokihisa KANEGUCHI, Yoshiya Hagimoto, Kenichi Aoyagi +1 more |
2018-07-17 |
| 9991301 |
Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the same |
Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya +4 more |
2018-06-05 |
| 9941326 |
Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrate |
Kenichi Aoyagi, Yoshiya Hagimoto, Hayato Iwamoto |
2018-04-10 |
| 9911778 |
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
Yoshihisa Kagawa, Kenichi Aoyagi, Yoshiya Hagimoto |
2018-03-06 |