Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE47087 | Semiconductor device, fabrication process, and electronic device | — | 2018-10-16 |
| 10038021 | Packaged image sensor having improved dicing properties | Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya +4 more | 2018-07-31 |
| 9991301 | Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the same | Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya +4 more | 2018-06-05 |