Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9949371 | Resin composite electrolytic copper foil, copper clad laminate and printed wiring board | Mitsuru Nozaki, Norikatsu Akiyama, Eiji Nagata, Masashi Yano | 2018-04-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9949371 | Resin composite electrolytic copper foil, copper clad laminate and printed wiring board | Mitsuru Nozaki, Norikatsu Akiyama, Eiji Nagata, Masashi Yano | 2018-04-17 |