Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10149347 | Front-end integrated circuit for WLAN applications | Chun-Wen Paul Huang, Lui Lam, Mark M. Doherty | 2018-12-04 |
| 10103254 | Semiconductor die fabrication methods | — | 2018-10-16 |
| 10069466 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Bharatjeet Singh Gill, Stephen Joseph Kovacic | 2018-09-04 |