Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157858 | Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure | Won Duck JUNG, Sung Mook LIM | 2018-12-18 |
| 10115708 | Semiconductor package having a redistribution line structure | Ju-il Eom, Jae-Hoon Lee | 2018-10-30 |