Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002851 | Semiconductor packages including chip enablement pads | Ki-Yong Lee, Sang Hwan Kim | 2018-06-19 |
| 9875990 | Semiconductor package including planar stacked semiconductor chips | Ki-Yong Lee, Jong Hyun Kim, Hyoung Min IM | 2018-01-23 |