HL

Hyun-Bae Lee

Samsung: 2 patents #3,558 of 15,403Top 25%
SH Sk Hynix: 1 patents #311 of 846Top 40%
Overall (2018): #73,289 of 503,207Top 15%
3
Patents 2018

Issued Patents 2018

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10068878 Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCB Jin-Gyu Kim, Ji-Sun Hong, Su-jung Hyung, Hyun Ki Kim 2018-09-04
9953921 Semiconductor device and semiconductor package 2018-04-24
9867283 Package board and prepreg Jin-Gyu Kim, Dong-Han Kim 2018-01-09