Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10123413 | Package substrate and manufacturing method thereof | Chih-Hong Chuang | 2018-11-06 |
| 9883599 | Manufacturing method for multi-layer circuit board having cavity | — | 2018-01-30 |
| 9877386 | Substrate structure and method of manufacturing the same | Cheng-An Chang, Sung-Huan Sun, Yi-Cheih Chen, Wen-Kai Liao | 2018-01-23 |