Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10164144 | Bond and release layer transfer process | Sien G. Kang, Mingyu ZHONG, Minghang LI | 2018-12-25 |
| 10087551 | Method and device for slicing a shaped silicon ingot using layer transfer | — | 2018-10-02 |
| 10041187 | Techniques for forming optoelectronic devices | Sien G. Kang, Albert Lamm | 2018-08-07 |
| 9859458 | Bond and release layer transfer process | Sien G. Kang, Mingyu ZHONG, Minghang LI | 2018-01-02 |