Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960120 | Wiring substrate with buried substrate having linear conductors | Ryo Fukasawa, Michio Horiuchi | 2018-05-01 |
| 9922960 | Packaging structure of substrates connected by metal terminals | — | 2018-03-20 |