Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9935043 | Interconnection substrate and semiconductor package | Satoshi Fujii | 2018-04-03 |
| 9899304 | Wiring substrate and semiconductor device | Keiji Yoshizawa, Hirokazu Yoshino, Kenta Uchiyama | 2018-02-20 |