Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115580 | Method for manufacturing an SOI wafer | Susumu Kuwabara | 2018-10-30 |
| 9953860 | Method of manufacturing SOI wafer | — | 2018-04-24 |
| 9865497 | Method for manufacturing bonded wafer | Isao Yokokawa, Hiroshi Fujisawa | 2018-01-09 |
| 9859149 | Method of producing bonded wafer with uniform thickness distribution | Norihiro Kobayashi | 2018-01-02 |