Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960325 | Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same | Yasuko Imanishi | 2018-05-01 |
| 9903597 | Cooking device including buffer chamber | Masahiro Nishijima, Takashi Utsumi | 2018-02-27 |