Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9925770 | Wiring substrate, MEMS device, liquid ejecting head, and liquid ejecting apparatus | Motoki Takabe, Shuichi Tanaka, Yasuyuki Matsumoto, Eiju Hirai | 2018-03-27 |
| 9919528 | Liquid ejecting head, liquid ejecting apparatus, and liquid ejecting head manufacturing method | Motoki Takabe, Yasuyuki Matsumoto, Shunya Fukuda, Daisuke Kobayashi | 2018-03-20 |