HI

Hideki ISHIGAMI

SE Seiko Epson: 1 patents #596 of 1,382Top 45%
📍 Hachinohe, JP: #4 of 6 inventorsTop 70%
Overall (2018): #398,997 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9954160 Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object Hidefumi NAKAMURA, Yukihiko SHIOHARA, Tetsuya Otsuki, Tetsuro MIYAO 2018-04-24