Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128218 | Semiconductor device including die bond pads at a die edge | Junrong Yan, Chee Keong Chin, Chong Un Tan, Ming Xia Wu, Shrikar Bhagath | 2018-11-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128218 | Semiconductor device including die bond pads at a die edge | Junrong Yan, Chee Keong Chin, Chong Un Tan, Ming Xia Wu, Shrikar Bhagath | 2018-11-13 |