Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147706 | Multi-chip package and method of manufacturing the same | Byong-Joo Kim, Yong Je Lee, Jae-heung Lee, Seung-Weon Ha | 2018-12-04 |
WH
Won-Gil Han
Overall (2018): #192,617 of 503,207Top 40%
1
Patents 2018