Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157868 | Fan-out semiconductor package | Dae Jung Byun, Byung Ho Kim, Pyung Hwa Han, Joo Young Choi | 2018-12-18 |
| 9929100 | Electronic component package and method of manufacturing the same | Doo Hwan Lee, Hyoung Joon Kim, Jong Rip Kim, Kyung Seob Oh | 2018-03-27 |