Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068824 | Electronic component package having electronic component within a frame on a redistribution layer | Kyu Bum Han, Chang Moo Jung, Kyung In Kang, Sang Kyu Lee | 2018-09-04 |
| 10068855 | Semiconductor package, method of manufacturing the same, and electronic device module | Tae Hyun Kim, Kyu Bum Han, Kwan Hoo Son | 2018-09-04 |