Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899584 | Semiconductor device and package including solder bumps with strengthened intermetallic compound | — | 2018-02-20 |
SH
Seok Min Hwang
Overall (2018): #245,647 of 503,207Top 50%
1
Patents 2018