Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9869717 | Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same | So-Young Lim | 2018-01-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9869717 | Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same | So-Young Lim | 2018-01-16 |