Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9930815 | Multi-layer PCB having function of dissipating heat from power semiconductor module package and PCB, and production method thereof | — | 2018-03-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9930815 | Multi-layer PCB having function of dissipating heat from power semiconductor module package and PCB, and production method thereof | — | 2018-03-27 |