Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134695 | Fan-out semiconductor package | Doo Hwan Lee, Ju Hyeon KIM, Hyoung Joon Kim | 2018-11-20 |
| 9902808 | Copolymerized polyamide resin, method for preparing the same and molded article comprising the same | So Young KWON, Jin Kyu Kim, Young Sub Jin, Ki Yon LEE, Suk Min JUN | 2018-02-27 |