Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032706 | Package substrates | Jingyu Kim, Taehun Kim, Byungmoon Bae, Se-Ho You | 2018-07-24 |
JH
JiSun Hong
Overall (2018): #372,118 of 503,207Top 75%
1
Patents 2018