Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032738 | Method for forming bump of semiconductor package | Bum Wook Park | 2018-07-24 |
| 10003049 | Secondary battery of improved safety | Sungjin Kwon, Soonho Ahn, Ki Woong Kim, Young Hun Kim | 2018-06-19 |
| 9902064 | Apparatus for controlling stiffness of output link in moving mechanism | Kwang Gi Kim, Chang Nho Cho | 2018-02-27 |