Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147713 | Semiconductor package having mold layer with curved corner and method of fabricating same | Yeongseok Kim | 2018-12-04 |
| 10115613 | Method of fabricating a fan-out panel level package and a carrier tape film therefor | Won-Gi Chang, Yeongseok Kim | 2018-10-30 |
| 9929131 | Method of fabricating a semiconductor package having mold layer with curved corner | Yeongseok Kim | 2018-03-27 |