Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068881 | Package-on-package type semiconductor package and method of fabricating the same | — | 2018-09-04 |
| 9859237 | Chip using triple pad configuration and packaging method thereof | Inhyuk Kim | 2018-01-02 |