Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941247 | Stack semiconductor device and memory device with driving circuits connected to through-silicon-vias (TSV) in different substrates in a staggered manner | Hae-Suk Lee, Kyo-Min Sohn, Ho-Young Song, Sang Hoon Shin | 2018-04-10 |