Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115635 | Method for filling a wafer via with solder | Sehoon Yoo, Jun Ki Kim, Jeong Han Kim, Young Ki Ko | 2018-10-30 |
| 10048639 | Unidirectional clutch and electrophotographic image forming apparatus employing the same | Han Jun Lee | 2018-08-14 |
| 10034381 | Flexible substrate having a via-hole with a conductive material and a method for manufacturing the same | Yong Jin Kim, Jae Hak Lee, Ju Yong Lee, Joon-Yub Song, Seung Man Kim +1 more | 2018-07-24 |
| 9951883 | Apparatus and method of measuring coil current of hydraulic valve | Jung Wook Seo, Kwan-Seek Kim | 2018-04-24 |