Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9969610 | Wafer level MEMS package including dual seal ring | Buu Q. Diep, Thomas A. Kocian, Mark A. Lamb | 2018-05-15 |
| 9966320 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian | 2018-05-08 |
| 9865519 | Use of an external getter to reduce package pressure | Stephen H. Black | 2018-01-09 |