Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103106 | Wafer level fan-out with electromagnetic shielding | Dan Carey, Ma Shirley Asoy | 2018-10-16 |
| 9936578 | Redistribution layer system in package | Mohsen Haji-Rahim, Mark Charles Held | 2018-04-03 |