Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10064289 | High speed solder deposition and reflow for a printed flexible electronic medium | Jamie Rieg, Randal Taylor, Willie Fowlkes, Paul Janousek | 2018-08-28 |
| 10049848 | Photocathode and method for assembly | John Smedley, Klaus Attenkofer, Susanne Schubert, Mengjia Gaowei | 2018-08-14 |