HY

Hikaru Yoshida

KA Kaijo: 1 patents #2 of 4Top 50%
📍 Ibaraki, JP: #213 of 638 inventorsTop 35%
Overall (2018): #396,070 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10022821 Bonding method and bonding device Mizuho Shiroto 2018-07-17