Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128211 | Thin fan-out multi-chip stacked package structure and manufacturing method thereof | Chia-Wei Chang, Yu-Tso Lin | 2018-11-13 |
| 10079222 | Package-on-package structure and manufacturing method thereof | Chien-Wei Chou | 2018-09-18 |
| 9859187 | Ball grid array package with protective circuitry layout and a substrate utilized in the package | — | 2018-01-02 |