Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121736 | Method of fabricating packaging layer of fan-out chip package | Chia-Wei Chang | 2018-11-06 |
| 9899307 | Fan-out chip package with dummy pattern and its fabricating method | Chia-Wei Chang | 2018-02-20 |