Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10044003 | Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant | Young-Jun Park, Kyoung-Bo Kim, Moo-Jin Kim, Jae Ryung Lee | 2018-08-07 |