Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899343 | High voltage tolerant bonding pad structure for trench-based semiconductor devices | Steven Kosier, Tatsuya Kamimura, Don Rankila | 2018-02-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899343 | High voltage tolerant bonding pad structure for trench-based semiconductor devices | Steven Kosier, Tatsuya Kamimura, Don Rankila | 2018-02-20 |