Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141204 | Film, method for its production, and method for producing semiconductor element using the film | Seigo Kotera, Wataru KASAI | 2018-11-27 |
| 9859133 | Mold release film and process for producing semiconductor package | Wataru KASAI | 2018-01-02 |