Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9932473 | Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition | Kazuto Ogawa, Kota Ishikawa, Takayuki Tsuji | 2018-04-03 |