Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10039194 | Dual solder layer for fluidic self assembly and electrical component substrate and method employing same | Alan Lenef, Adam Scotch | 2018-07-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10039194 | Dual solder layer for fluidic self assembly and electrical component substrate and method employing same | Alan Lenef, Adam Scotch | 2018-07-31 |