Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997671 | Composite substrate, semiconductor chip having a composite substrate and method for producing composite substrates and semiconductor chips | Johannes Baur, Berthold Hahn, Karl Engl, Joachim Hertkorn, Tetsuya Taki | 2018-06-12 |