Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109562 | Leadframe and chip package comprising a leadframe | Mei See Boon, Wing Yew Wong, Hui Ying Pee | 2018-10-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109562 | Leadframe and chip package comprising a leadframe | Mei See Boon, Wing Yew Wong, Hui Ying Pee | 2018-10-23 |